MC2010P-1051-DB101W
vs
MC2010-1051-DT101W
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
RCD COMPONENTS INC
Package Description
CHIP, ROHS COMPLIANT
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Total Weight
18.151
18.151
Category CO2 Kg
4.54
4.54
CO2
82.40554
82.40554
Compliance Temperature Grade
Military: -55C to +155C
Military: -55C to +155C
EU RoHS Version
RoHS 2 (2015/863/EU)
RoHS 2 (2015/863/EU)
EU RoHS Exemptions
7(c)-I
7(c)-I
Candidate List Date
2024-01-23
2024-01-23
CAS Accounted for Wt
100
100
CA Prop 65 Presence
YES
YES
CA Prop 65 CAS Numbers
1317-36-8, 7440-02-0
1317-36-8, 7440-02-0
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.31
CMRT V6.31
Additional Feature
PRECISION
PRECISION
Construction
Chip
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.6 mm
2.6 mm
Packing Method
BULK
TR
Rated Power Dissipation (P)
0.75 W
0.75 W
Resistance
1050 Ω
1050 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Rated Temperature
70 °C
Compare MC2010P-1051-DB101W with alternatives
Compare MC2010-1051-DT101W with alternatives