MC2010L6F9530SE vs RS10K9530FBG feature comparison

MC2010L6F9530SE SPC Multicomp

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RS10K9530FBG Fenghua (HK) Electronics Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer SPC TECHNOLOGY/ MULTICOMP FENGHUA ADVANCED TECHNOLOGY
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Construction Multilayer Chip RECTANGULAR PACKAGE
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, Embossed Plastic, 7 Inch Bulk
Rated Power Dissipation (P) 0.75 W 0.75 W
Resistance 953 Ω 953 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

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