MC2010-57R6-FBQ
vs
RK73HW2HRTTEB57R6F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
RCD COMPONENTS INC
KOA CORP
Package Description
CHIP
SMT, 2010
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Construction
Rectangular
Chip
JESD-609 Code
e0
e3
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Style
SMT
SMT
Package Width
2.6 mm
2.5 mm
Packing Method
Bulk
TR, 13 Inch
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
70 °C
Resistance
57.6 Ω
57.6 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
2
Additional Feature
ANTI-SULFUR
Compare MC2010-57R6-FBQ with alternatives
Compare RK73HW2HRTTEB57R6F with alternatives