MC2010-2262-DBQ
vs
MC2010P-2262-DT101W
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
RCD COMPONENTS INC
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Construction
Rectangular
Chip
JESD-609 Code
e0
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Style
SMT
SMT
Package Width
2.6 mm
2.6 mm
Packing Method
Bulk
TR
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
70 °C
Resistance
22600 Ω
22600 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Pbfree Code
Additional Feature
PRECISION
Package Shape
RECTANGULAR PACKAGE
Compare MC2010-2262-DBQ with alternatives
Compare MC2010P-2262-DT101W with alternatives