MC2010-2262-DB101Q
vs
RMF20DE2262
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
TA-I TECHNOLOGY CO LTD
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Additional Feature
PRECISION
Construction
Chip
Rectangular
JESD-609 Code
e0
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.6 mm
2.5 mm
Packing Method
BULK
TR, EMBOSSED PLASTIC, 7 INCH
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
70 °C
70 °C
Resistance
22600 Ω
22600 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Category CO2 Kg
4.54
Compliance Temperature Grade
Military: -55C to +155C
EU RoHS Version
RoHS 2 (2015/863/EU)
EU RoHS Exemptions
7(c)-I
Candidate List Date
2024-01-23
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.22
Qualifications
AEC-Q200
Reference Standard
AEC-Q200
Compare MC2010-2262-DB101Q with alternatives
Compare RMF20DE2262 with alternatives