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MC2010-2261-FBQ vs 201007F2261B4 feature comparison

MC2010-2261-FBQ RCD Components Inc

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201007F2261B4 Royal Electronic Factory (Thailand) Co Ltd

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer RCD COMPONENTS INC ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e0
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.6 mm 2.5 mm
Packing Method Bulk
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C
Resistance 2260 Ω 2260 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Series 2010(3/4WS,F TOL)
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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