MC2010-1803-DB101 vs MC2010-1803-DT101W feature comparison

MC2010-1803-DB101 RCD Components Inc

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MC2010-1803-DT101W RCD Components Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC RCD COMPONENTS INC
Package Description CHIP CHIP, ROHS COMPLIANT
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature PRECISION PRECISION
Construction Chip Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.6 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.6 mm 2.6 mm
Packing Method BULK TR
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C 70 °C
Resistance 180000 Ω 180000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier

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