We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

MC2010-1213-DB101W vs RS10K1213DT feature comparison

MC2010-1213-DB101W RCD Components Inc

Buy Now Datasheet

RS10K1213DT Fenghua (HK) Electronics Ltd

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC FENGHUA ADVANCED TECHNOLOGY
Package Description CHIP, ROHS COMPLIANT
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature PRECISION
Construction Chip Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.6 mm 2.5 mm
Packing Method BULK TR
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C
Resistance 121000 Ω 121000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare MC2010-1213-DB101W with alternatives

Compare RS10K1213DT with alternatives