MC14568BCP vs HD74LS192FPEL feature comparison

MC14568BCP Motorola Mobility LLC

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HD74LS192FPEL Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC RENESAS ELECTRONICS CORP
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP BIDIRECTIONAL
Family 4000/14000/40000 LS
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e0
Length 19.175 mm 10.06 mm
Load/Preset Input YES YES
Logic IC Type DIVIDE BY N COUNTER DECADE COUNTER
Mode of Operation ASYNCHRONOUS SYNCHRONOUS
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C -20 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 1440 ns 47 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.44 mm 2.2 mm
Supply Voltage-Max (Vsup) 18 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 5.5 mm
fmax-Min 3 MHz 25 MHz
Base Number Matches 3 3
Pbfree Code Yes
Max Frequency@Nom-Sup 25000000 Hz
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 34 mA
Time@Peak Reflow Temperature-Max (s) 20

Compare MC14568BCP with alternatives

Compare HD74LS192FPEL with alternatives