MC14562BALD
vs
MC14562BCLD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
OUTPUTS ALSO AVAILABLE AT 16TH, 32ND, 48TH, 64TH, 80TH, 96TH AND 112TH STAGE OF THE SHIFT REGISTER
Count Direction
RIGHT
Family
4000/14000/40000
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
JESD-609 Code
e0
e0
Length
19.495 mm
Load Capacitance (CL)
50 pF
Logic IC Type
SERIAL IN SERIAL OUT
Number of Bits
128
128
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
1200 ns
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Width
7.62 mm
fmax-Min
1.1 MHz
Base Number Matches
3
3
Power Supplies
5/15 V
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