MC14560BCLDS
vs
74F582SC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP16,.3
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BCD ADDER
|
BCD ADDER/SUBTRACTOR; CAPABLE OF COMPARISON AND BINARY TO BCD CONVERSION
|
| Family |
4000/14000/40000
|
F/FAST
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
|
| Length |
19.3 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
ADDER/SUBTRACTOR
|
ADDER/SUBTRACTOR
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
24
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
2100 ns
|
17 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.19 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
24
|
|
|
|
Compare MC14560BCLDS with alternatives
Compare 74F582SC with alternatives