MC14560BAL vs MC14560BCL feature comparison

MC14560BAL Freescale Semiconductor

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MC14560BCL Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T16 R-GDIP-T16
JESD-609 Code e0 e0
Logic IC Type ADDER/SUBTRACTOR ADDER/SUBTRACTOR
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5/15 V
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3
Part Package Code DIP
Pin Count 16
HTS Code 8542.39.00.01
Additional Feature BCD ADDER; WITH INTERNAL RIPPLE CARRY; PERMITS RIPPLE CARRY CASCADING
Family 4000/14000/40000
Length 19.49 mm
Load Capacitance (CL) 50 pF
Number of Bits 4
Number of Functions 1
Propagation Delay (tpd) 2100 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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