MC14544BAL
vs
MC14544BCLD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP18,.3
DIP, DIP18,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Family
4000/14000/40000
Input Conditioning
LATCHED
JESD-30 Code
R-GDIP-T18
R-XDIP-T18
JESD-609 Code
e0
e0
Length
22.73 mm
Load Capacitance (CL)
50 pF
Logic IC Type
SEVEN SEGMENT DECODER/DRIVER
OTHER DECODER/DRIVER
Number of Functions
1
Number of Terminals
18
18
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
CONFIGURABLE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
1650 ns
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
3
3
Power Supplies
5/15 V
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