MC14519BAL vs MC14519BCP feature comparison

MC14519BAL Motorola Semiconductor Products

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MC14519BCP Motorola Semiconductor Products

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CONFIGURABLE AS QUAD 2:1 MUX CONFIGURABLE AS 2:1 MUX
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 19.3 mm 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type XNOR GATE XNOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 500 ns 500 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm 4.44 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 5
Max I(ol) 0.00064 A
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 500 ns

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