MC14519BAL
vs
MC14519BCP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Category CO2 Kg
12.4
Compliance Temperature Grade
Military: -55C to +125C
Additional Feature
CONFIGURABLE AS QUAD 2:1 MUX
CONFIGURABLE AS 2:1 MUX
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
19.3 mm
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
XNOR GATE
XNOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
500 ns
500 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.19 mm
4.44 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
4
3
Part Package Code
DIP
Pin Count
16
Max I(ol)
0.00064 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
500 ns
Compare MC14519BAL with alternatives
Compare MC14519BCP with alternatives