MC14514BALD vs MC74LCX139MEL feature comparison

MC14514BALD Motorola Mobility LLC

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MC74LCX139MEL onsemi

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC ON SEMICONDUCTOR
Part Package Code DIP SOIC
Package Description DIP, DIP24,.6 SOP, SOP16,.3
Pin Count 24 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 LVC/LCX/Z
Input Conditioning LATCHED STANDARD
JESD-30 Code R-CDIP-T24 R-PDSO-G16
JESD-609 Code e0 e4
Length 32.005 mm 10.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 2-LINE TO 4-LINE DECODER
Number of Functions 1 2
Number of Terminals 24 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP24,.6 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 1100 ns 9.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.59 mm 2.05 mm
Supply Voltage-Max (Vsup) 18 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 5 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 5.275 mm
Base Number Matches 2 2
Max I(ol) 0.024 A
Moisture Sensitivity Level 3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 6.2 ns

Compare MC14514BALD with alternatives

Compare MC74LCX139MEL with alternatives