MC14513BCP
vs
MC14513BALD
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-18
|
DIP, DIP18,.3
|
| Pin Count |
18
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
onsemi
|
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| Input Conditioning |
LATCHED
|
LATCHED
|
| JESD-30 Code |
R-PDIP-T18
|
R-GDIP-T18
|
| JESD-609 Code |
e0
|
e0
|
| Length |
22.73 mm
|
22.73 mm
|
| Logic IC Type |
SEVEN SEGMENT DECODER/DRIVER
|
SEVEN SEGMENT DECODER/DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
18
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP18,.3
|
DIP18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Propagation Delay (tpd) |
1440 ns
|
1440 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
| Load Capacitance (CL) |
|
50 pF
|
|
|
|
Compare MC14513BCP with alternatives
Compare MC14513BALD with alternatives