MC14512BD
vs
CD4512BPWRG4
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
TSSOP
Package Description
SOIC-16
TSSOP, TSSOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e4
Length
9.9 mm
5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
NOT SPECIFIED
1
Number of Functions
1
1
Number of Inputs
8
8
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
650 ns
360 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.75 mm
1.2 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
4.4 mm
Base Number Matches
5
1
Rohs Code
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
Package Equivalence Code
TSSOP16,.25
Packing Method
TR
Prop. Delay@Nom-Sup
360 ns
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