MC14175BFR2
vs
MM54C107N
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP16,.3
|
DIP,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
CMOS
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T14
|
| JESD-609 Code |
e0
|
|
| Length |
10.2 mm
|
19.215 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D FLIP-FLOP
|
J-K FLIP-FLOP
|
| Max Frequency@Nom-Sup |
2000000 Hz
|
|
| Number of Bits |
4
|
2
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Packing Method |
TR
|
|
| Propagation Delay (tpd) |
400 ns
|
300 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.05 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
NEGATIVE EDGE
|
| Width |
5.275 mm
|
7.62 mm
|
| fmax-Min |
6.5 MHz
|
2.5 MHz
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC14175BFR2 with alternatives
Compare MM54C107N with alternatives