MC141624FU vs MC141624SP feature comparison

MC141624FU Motorola Semiconductor Products

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MC141624SP Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Package Description LQFP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type Y/C SEPARATOR IC Y/C SEPARATOR IC
JESD-30 Code S-PQFP-G32 R-PDIP-T32
Length 7 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP DIP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.8 mm
Terminal Position QUAD DUAL
Width 7 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 32

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