MC14099BF
vs
MC14099BDWG
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
End Of Life
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ONSEMI
|
| Part Package Code |
SOIC
|
SO-16 WB
|
| Package Description |
SOP, SOP16,.3
|
SOIC-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
|
1:8 DMUX FOLLOWED BY LATCH
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e3
|
| Length |
10.2 mm
|
10.3 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Number of Bits |
8
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.3
|
SOP16,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Prop. Delay@Nom-Sup |
400 ns
|
400 ns
|
| Propagation Delay (tpd) |
400 ns
|
400 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.05 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
LOW LEVEL
|
LOW LEVEL
|
| Width |
5.275 mm
|
7.5 mm
|
| Base Number Matches |
5
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
751G-03
|
| Factory Lead Time |
|
2 Days
|
| Samacsys Manufacturer |
|
onsemi
|
| Moisture Sensitivity Level |
|
3
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC14099BF with alternatives
Compare MC14099BDWG with alternatives