MC14099BCPDS
vs
MC14099BCL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
ON SEMICONDUCTOR
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
not_compliant
JESD-30 Code
R-PDIP-T16
R-XDIP-T16
JESD-609 Code
e0
e0
Logic IC Type
D LATCH
D LATCH
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
4
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
Prop. Delay@Nom-Sup
400 ns
Qualification Status
Not Qualified