MC14099BCLDS
vs
MC14099BCPG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
ONSEMI
Package Description
DIP, DIP16,.3
ROHS COMPLIANT, PLASTIC, DIP-16
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-XDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e3
Logic IC Type
D LATCH
D LATCH
Number of Bits
8
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Pbfree Code
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
Additional Feature
1:8 DMUX FOLLOWED BY LATCH
Family
4000/14000/40000
Length
19.175 mm
Load Capacitance (CL)
50 pF
Output Polarity
TRUE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
400 ns
Propagation Delay (tpd)
400 ns
Qualification Status
Not Qualified
Seated Height-Max
4.44 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
40
Trigger Type
LOW LEVEL
Width
7.62 mm
Compare MC14099BCPG with alternatives