MC14099BALD
vs
MC14099BDW
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
ON SEMICONDUCTOR
Part Package Code
DIP
SOIC
Package Description
DIP, DIP16,.3
PLASTIC, SOIC-16
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1:8 DMUX FOLLOWED BY LATCH
1:8 DMUX FOLLOWED BY LATCH
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e0
Length
19.3 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D LATCH
D LATCH
Number of Bits
1
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
400 ns
400 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.19 mm
2.65 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
LOW LEVEL
Width
7.62 mm
7.5 mm
Base Number Matches
2
4
Moisture Sensitivity Level
1
Packing Method
RAIL
Peak Reflow Temperature (Cel)
235
Prop. Delay@Nom-Sup
400 ns
Compare MC14099BALD with alternatives
Compare MC14099BDW with alternatives