Findchips: Compare MC14070BCPDS vs HEF4070BT,653

MC14070BCPDS vs HEF4070BT,653 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	MOTOROLA INC	NEXPERIA
Part Package Code	DIP	SOIC
Package Description	DIP, DIP14,.3	PLASTIC, SOT-108-1, SO-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	4000/14000/40000	4000/14000/40000
JESD-30 Code	R-PDIP-T14	R-PDSO-G14
JESD-609 Code	e0	e4
Length	18.86 mm	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	XOR GATE	XOR GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Equivalence Code	DIP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Propagation Delay (tpd)	350 ns	175 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	4.69 mm	1.75 mm
Supply Voltage-Max (Vsup)	18 V	15 V
Supply Voltage-Min (Vsup)	3 V	3 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	TIN LEAD	NICKEL PALLADIUM GOLD
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	3.9 mm
Base Number Matches	1	1
Manufacturer Package Code		SOT108-1
ECCN Code		EAR99
Factory Lead Time		8 Weeks
Date Of Intro		1990-01-01
Samacsys Manufacturer		Nexperia
Moisture Sensitivity Level		1
Packing Method		TR, 13 INCH
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates