MC14066BD
vs
935174980112
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
NXP SEMICONDUCTORS
|
| Package Description |
SOP, SOP14,.25
|
SSOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
SPST
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Normal Position |
NO
|
|
| Number of Functions |
4
|
3
|
| Number of Terminals |
14
|
16
|
| On-state Resistance-Max (Ron) |
1300 Ω
|
165 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SSOP
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Power Supplies |
5/15 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
6.2 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Channels |
|
2
|
| Off-state Isolation-Nom |
|
50 dB
|
| On-state Resistance Match-Nom |
|
2 Ω
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
2 mm
|
| Supply Voltage-Nom (Vsup) |
|
6 V
|
| Switch-off Time-Max |
|
28 ns
|
| Switch-on Time-Max |
|
37 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
5.3 mm
|
|
|
|
Compare 935174980112 with alternatives