MC14060BCPDS
vs
MC14060BDR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
ON SEMICONDUCTOR
Package Description
DIP, DIP16,.3
SOP, SOP16,.25
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
OUTPUTS FROM 10 STAGES AVAILABLE
Count Direction
UP
UP
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e0
Length
20.07 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Load/Preset Input
NO
NO
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max Frequency@Nom-Sup
3500000 Hz
3500000 Hz
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Bits
14
14
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
740 ns
740 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.69 mm
1.75 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
7.62 mm
3.9 mm
fmax-Min
3.5 MHz
12 MHz
Base Number Matches
1
2
Part Package Code
SOIC
Pin Count
16
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
235
Compare MC14060BCPDS with alternatives
Compare MC14060BDR2 with alternatives