MC14050BCL
vs
MC14050BCLDS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUFFER
BUFFER
Max I(ol)
0.006 A
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
Prop. Delay@Nom-Sup
140 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
HTS Code
8542.39.00.01
Additional Feature
CMOS-TTL LEVEL TRANSLATOR
Family
4000/14000/40000
Length
19.3 mm
Number of Functions
6
Number of Inputs
1
Propagation Delay (tpd)
80 ns
Seated Height-Max
4.19 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Width
7.62 mm
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