MC14044BDR2
vs
HEF4044BF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
SOIC-16
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
JESD-609 Code
e0
Length
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
R-S LATCH
R-S LATCH
Max I(ol)
0.00088 A
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TR
Prop. Delay@Nom-Sup
350 ns
Propagation Delay (tpd)
350 ns
185 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
LOW LEVEL
Width
3.9 mm
7.62 mm
Base Number Matches
5
1
Part Package Code
DIP
Pin Count
16
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