MC14044BALDS
vs
MC14044BCPG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
ONSEMI
Package Description
DIP, DIP16,.3
ROHS COMPLIANT, PLASTIC, DIP-16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e3
Length
19.3 mm
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
R-S LATCH
R-S LATCH
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
350 ns
350 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.19 mm
4.44 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
LOW LEVEL
Width
7.62 mm
7.62 mm
Base Number Matches
3
1
Pbfree Code
Part Package Code
DIP
Pin Count
16
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
350 ns
Compare MC14044BALDS with alternatives
Compare MC14044BCPG with alternatives