MC14043BFL1
vs
MC14043BALDS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
MOTOROLA INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP16,.3
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
JESD-609 Code
e0
e0
Length
10.2 mm
19.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
R-S LATCH
R-S LATCH
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TR
Prop. Delay@Nom-Sup
350 ns
Propagation Delay (tpd)
350 ns
350 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
4.19 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
HIGH LEVEL
HIGH LEVEL
Width
5.275 mm
7.62 mm
Base Number Matches
1
1
Compare MC14043BFL1 with alternatives
Compare MC14043BALDS with alternatives