MC14043BCL vs HEF4043BT feature comparison

MC14043BCL Motorola Mobility LLC

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HEF4043BT NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0 e4
Length 19.495 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type R-S LATCH R-S LATCH
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 350 ns 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL HIGH LEVEL
Width 7.62 mm 3.9 mm
Base Number Matches 3 9
Pbfree Code Yes
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 180 ns
Time@Peak Reflow Temperature-Max (s) 30

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