MC14043BALD
vs
MC14043BD
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
DIP, DIP16,.3
|
SOP, SOP16,.25
|
Reach Compliance Code |
unknown
|
unknown
|
JESD-30 Code |
R-XDIP-T16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e0
|
Logic IC Type |
R-S LATCH
|
R-S LATCH
|
Number of Bits |
1
|
1
|
Number of Functions |
4
|
4
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Power Supplies |
5/15 V
|
5/15 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
5
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.00088 A
|
Prop. Delay@Nom-Sup |
|
350 ns
|
Qualification Status |
|
Not Qualified
|
|
|
|