MC14035BAL
vs
8101701EX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
TEXAS INSTRUMENTS INC
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
compliant
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
Qualification Status
Not Qualified
Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
4
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
Additional Feature
J AND KBAR SERIAL INPUT
Count Direction
RIGHT
Family
4000/14000/40000
Length
19.56 mm
Logic IC Type
PARALLEL IN PARALLEL OUT
Output Polarity
CONFIGURABLE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
500 ns
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Trigger Type
POSITIVE EDGE
Width
7.62 mm
fmax-Min
8 MHz
Compare 8101701EX with alternatives