MC14028BCP
vs
933282730652
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
Logic IC Type
DECIMAL DECODER/DRIVER
DECIMAL DECODER/DRIVER
Max I(ol)
0.00088 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
Prop. Delay@Nom-Sup
600 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
Pbfree Code
Part Package Code
DIP
Pin Count
16
ECCN Code
EAR99
HTS Code
8542.39.00.01
Family
4000/14000/40000
Input Conditioning
STANDARD
Length
21.6 mm
Output Polarity
TRUE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
200 ns
Seated Height-Max
4.7 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
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