MC14028BCLD
vs
10162F
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-XDIP-T16
|
R-XDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
DECIMAL DECODER/DRIVER
|
OTHER DECODER/DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-30 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supplies |
5/15 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
4
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Power Supply Current-Max (ICC) |
|
84 mA
|
| Prop. Delay@Nom-Sup |
|
6.4 ns
|
| Qualification Status |
|
Not Qualified
|
|
|
|