MC14027BFL2
vs
MC14027BCP
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP16,.3
|
DIP, DIP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
10.2 mm
|
19.175 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
| Max Frequency@Nom-Sup |
1500000 Hz
|
6500000 Hz
|
| Number of Bits |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Packing Method |
TR
|
|
| Propagation Delay (tpd) |
350 ns
|
350 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.05 mm
|
4.44 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
5.275 mm
|
7.62 mm
|
| fmax-Min |
6.5 MHz
|
1.5 MHz
|
| Base Number Matches |
2
|
4
|
| Max I(ol) |
|
0.00088 A
|
|
|
|
Compare MC14027BFL2 with alternatives
Compare MC14027BCP with alternatives