MC14027BFL1 vs MC14027BCLD feature comparison

MC14027BFL1 Rochester Electronics LLC

Buy Now Datasheet

MC14027BCLD Freescale Semiconductor

Buy Now Datasheet
Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code SOIC
Package Description EIAJ, PLASTIC, SOIC-16 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-XDIP-T16
JESD-609 Code e0 e0
Length 10.2 mm
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 350 ns
Qualification Status Not Qualified
Seated Height-Max 2.05 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE MASTER-SLAVE
Width 5.275 mm
fmax-Min 6.5 MHz
Base Number Matches 2 3
Package Equivalence Code DIP16,.3
Power Supplies 5/15 V
Technology CMOS

Compare MC14027BFL1 with alternatives