MC14027BDR2G
vs
MC14027BCP
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
SOIC 16 LEAD
|
|
Package Description |
SOIC-16
|
DIP, DIP16,.3
|
Pin Count |
16
|
|
Manufacturer Package Code |
751B-05
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
onsemi
|
|
Family |
4000/14000/40000
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
JESD-609 Code |
e3
|
e0
|
Length |
9.9 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
Max Frequency@Nom-Sup |
1500000 Hz
|
6500000 Hz
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
2
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.25
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
350 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Max (Vsup) |
18 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
MASTER-SLAVE
|
Width |
3.9 mm
|
|
fmax-Min |
6.5 MHz
|
|
Base Number Matches |
1
|
4
|
Rohs Code |
|
No
|
Max I(ol) |
|
0.00088 A
|
Power Supplies |
|
5/15 V
|
|
|
|
Compare MC14027BDR2G with alternatives