MC14024BCLG vs TC4024BP feature comparison

MC14024BCLG Motorola Semiconductor Products

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TC4024BP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Package Description DIP, 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Length 19.495 mm 19.25 mm
Load/Preset Input YES NO
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 7 7
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 2000 ns 1200 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 1 MHz 12 MHz
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 3500000 Hz
Max I(ol) 0.00061 A
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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