MC14024BALDS
vs
HEF4024BP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
DIP, DIP14,.3
0.300 INCH, PLASTIC, SOT-27-1, DIP-14
Reach Compliance Code
unknown
compliant
Count Direction
UP
UP
JESD-30 Code
R-XDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e4
Load/Preset Input
YES
NO
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Pbfree Code
Part Package Code
DIP
Pin Count
14
ECCN Code
EAR99
HTS Code
8542.39.00.01
Family
4000/14000/40000
Length
19.025 mm
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
5000000 Hz
Max I(ol)
0.00035999999999999997 A
Number of Bits
7
Propagation Delay (tpd)
210 ns
Qualification Status
Not Qualified
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Trigger Type
NEGATIVE EDGE
Width
7.62 mm
fmax-Min
18 MHz
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