MC14016BCL vs HEF4016BDF feature comparison

MC14016BCL Motorola Mobility LLC

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HEF4016BDF NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-GDIP-T14 R-GDIP-T14
JESD-609 Code e0
Length 19.495 mm
Neg Supply Voltage-Nom (Vsup) -7.5 V
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
On-state Resistance Match-Nom 10 Ω 10 Ω
On-state Resistance-Max (Ron) 400 Ω 350 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Nom (Vsup) 7.5 V 15 V
Surface Mount NO NO
Switch-off Time-Max 35 ns 100 ns
Switch-on Time-Max 35 ns 30 ns
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Additional Feature 5V NOMINAL ALSO AVAILABLE
Off-state Isolation-Nom 50 dB

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