MC14013BDG vs HEF4013BTD feature comparison

MC14013BDG Rochester Electronics LLC

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HEF4013BTD NXP Semiconductors

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Pbfree Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 8.65 mm 8.65 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level NOT SPECIFIED 1
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 350 ns 220 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3.9 mm 3.9 mm
fmax-Min 7 MHz 7 MHz
Base Number Matches 2 2
Rohs Code Yes
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 7000000 Hz
Package Equivalence Code SOP14,.25
Packing Method BULK
Prop. Delay@Nom-Sup 220 ns

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