MC14013BDG
vs
HEF4013BTD
feature comparison
All Stats
Differences Only
Pbfree Code
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP14,.25
Pin Count
14
14
Reach Compliance Code
unknown
unknown
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
e4
Length
8.65 mm
8.65 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
NOT SPECIFIED
1
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
350 ns
220 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
3.9 mm
fmax-Min
7 MHz
7 MHz
Base Number Matches
2
2
Rohs Code
Yes
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
7000000 Hz
Package Equivalence Code
SOP14,.25
Packing Method
BULK
Prop. Delay@Nom-Sup
220 ns
Compare MC14013BDG with alternatives
Compare HEF4013BTD with alternatives