MC14012UBCL
vs
MC14012UBCPD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-CDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Length
19.495 mm
18.86 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
2
2
Number of Inputs
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
180 ns
Propagation Delay (tpd)
180 ns
180 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.08 mm
4.69 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
4
3
Power Supplies
5/15 V
Compare MC14012UBCL with alternatives
Compare MC14012UBCPD with alternatives