MC14011UBD
vs
HEF4011BT-Q100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
SOP, SOP14,.25
SOP,
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.0042 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Power Supplies
5/15 V
Prop. Delay@Nom-Sup
180 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
2
Part Package Code
SOIC
Pin Count
14
HTS Code
8542.39.00.01
Family
4000/14000/40000
Length
8.65 mm
Number of Functions
4
Number of Inputs
2
Propagation Delay (tpd)
110 ns
Screening Level
AEC-Q100
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Width
3.9 mm