MC14011UBCLD vs MC14011BCL feature comparison

MC14011UBCLD Motorola Semiconductor Products

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MC14011BCL Freescale Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-XDIP-T14
JESD-609 Code e0 e0
Length 19.495 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 180 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 3
Max I(ol) 0.0042 A
Power Supplies 5/15 V
Prop. Delay@Nom-Sup 250 ns

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