MC14008BDR2
vs
MC14008BDR2G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
ONSEMI
Package Description
SOP, SOP16,.25
SOIC-16
Reach Compliance Code
unknown
compliant
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e3
Logic IC Type
ADDER/SUBTRACTOR
ADDER/SUBTRACTOR
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Power Supplies
5/15 V
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
1
Pbfree Code
Part Package Code
SOIC 16 LEAD
Pin Count
16
Manufacturer Package Code
751B-05
HTS Code
8542.39.00.01
Factory Lead Time
10 Weeks
Samacsys Manufacturer
onsemi
Family
4000/14000/40000
Length
9.9 mm
Moisture Sensitivity Level
1
Number of Bits
4
Number of Functions
1
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
800 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Compare MC14008BDR2G with alternatives