Findchips: Compare MC14007UBDR2 vs HEF4007UBT,653

MC14007UBDR2 vs HEF4007UBT,653 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	MOTOROLA SEMICONDUCTOR PRODUCTS	NXP SEMICONDUCTORS
Package Description	SOP, SOP14,.25	PLASTIC, SO-14
Reach Compliance Code	unknown	compliant
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e0
Number of Terminals	14	14
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Equivalence Code	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Power Supplies	5/15 V
Qualification Status	Not Qualified	Not Qualified
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	Tin/Lead (Sn/Pb)	NICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Base Number Matches	5	2
Part Package Code		SOIC
Pin Count		14
Manufacturer Package Code		SOT108-1
HTS Code		8542.39.00.01
Additional Feature		DUAL COMPLEMENTARY PAIR PLUS INVERTER
Family		4000/14000/40000
Length		8.65 mm
Load Capacitance (CL)		50 pF
Logic IC Type		INVERTER
Moisture Sensitivity Level		1
Number of Functions		3
Number of Inputs		1
Peak Reflow Temperature (Cel)		260
Propagation Delay (tpd)		80 ns
Seated Height-Max		1.75 mm
Supply Voltage-Max (Vsup)		15 V
Supply Voltage-Min (Vsup)		3 V
Supply Voltage-Nom (Vsup)		5 V
Time@Peak Reflow Temperature-Max (s)		30
Width		3.9 mm
	Logic » Gates	Logic » Gates