MC14006BAL vs CD4006BFMSH feature comparison

MC14006BAL Freescale Semiconductor

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CD4006BFMSH Intersil Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS INTERSIL CORP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
JESD-30 Code R-XDIP-T14 R-XDIP-T14
JESD-609 Code e0 e0
Number of Bits 5 5
Number of Functions 1 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5/15 V
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
HTS Code 8542.39.00.01
Count Direction RIGHT
Family 4000/14000/40000
Logic IC Type SERIAL IN SERIAL OUT
Max Frequency@Nom-Sup 2500000 Hz
Output Polarity TRUE
Propagation Delay (tpd) 540 ns
Screening Level 38535V;38534K;883S
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Trigger Type NEGATIVE EDGE