MC14001UBCP vs MC14001UBCL feature comparison

MC14001UBCP Motorola Semiconductor Products

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MC14001UBCL Freescale Semiconductor

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-XDIP-T14
JESD-609 Code e0 e0
Length 18.86 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.004200000000000001 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 180 ns 180 ns
Propagation Delay (tpd) 180 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 4.69 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 5 4
Power Supplies 5/15 V